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ASML expands into hybrid bonding as Chinese chip firms adopt advanced packaging

ASML is moving into hybrid bonding, a next-generation chip packaging technique, filing 27 patent families between Dec 2022 and Nov 2024. Chinese firms are also adopting the technology to boost chip performance, signaling a competitive shift in advanced packaging. The move underscores ASML's diversification beyond lithography amid export controls and China's push for self-sufficiency.

South China Morning Post1 day agoNL, CNengCredibility 27%View source

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Mosaic Score4.8
Model confidence0.5
Significance0.5
Source credibility0.3
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