ASML Q3 Net Profit Doubles to €4.96B, Record High
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ASML is moving into hybrid bonding, a next-generation chip packaging technique, filing 27 patent families between Dec 2022 and Nov 2024. Chinese firms are also adopting the technology to boost chip performance, signaling a competitive shift in advanced packaging. The move underscores ASML's diversification beyond lithography amid export controls and China's push for self-sufficiency.
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