Sumitomo Bakelite expands China chip packaging output on AI demand

Sumitomo Bakelite announced expansion of advanced chip packaging material production in Suzhou, China, and Singapore, its second China expansion in under four months, driven by AI-fueled demand for sophisticated semiconductors. The move underscores accelerating supply-chain localization and capacity buildout for advanced packaging outside traditional hubs, with implications for semiconductor supply chains and trade dynamics.